· Half cut and MBB technology brings more BOS saving.
·Excellent Temperature Coefficient, Up to 5400 pa positive load and 2400 Pa negative load
· Parallel circuit design reduces Module power loss
· Better temperature coefficient.
· Ensured PID resistance through cell process and module material control
· Bifaciality is up to 80%, up to 30% more energy yield than conventional
modules.· Bifacial module up to 85% Bi-faciality
· EXCELLENT PID Resistance
· Lowest thermal degradation(Pmax<0.25%/℃)
· Low manufacturing energy consumption
· 15/30 years warranty
· Additional 5~25% power output by backside light absorption